Fine Line Fan Out Package on Panel Level

被引：0
|
作者：
Fann, Daniel [1 ]
Fang, David [1 ]
Chiang, Jeffery [1 ]
Huang, Kevin [1 ]
机构：
[1] Powertech Technol Inc, Hsinchu 30352, Taiwan
来源：
2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2017年
关键词：
Fan-out; panel level package; hetero-integration;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Advance package technology continues to innovate for More-than-Moore. To materialize heterogeneous integration of multiple functions, fine line package technology is essential. Fan out on panel level utilizes LCD and semiconductor process tools to realize high productivity. It makes fan out package cover a wide range of applications. The challenges, solutions and diversified applications are also discussed in this paper.
引用
收藏
页码：23 / 25
页数：3
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