Co-design optimization of laminate substrates for high speed applications

被引：3
|
作者：
de Araujo, DN [1 ]
Cases, M [1 ]
Pham, N [1 ]
Matoglu, E [1 ]
机构：
[1] IBM Corp, Austin, TX 78758 USA
来源：
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年
关键词：
D O I：
10.1109/ECTC.2004.1320359
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The need for optimization of electronic package solutions for digital applications is rapidly increasing as the electrical interfaces advance in complexity, speed, cost, and performance. Higher density and integration of functionality within a single chip requires the balance of various requirements for several different interfaces. Optimization of a laminate organic package for high speed application is presented. Results of this optimization are presented, as well as a discussion of the choices from the study.
引用
收藏
页码：1776 / 1783
页数：8
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