Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant

被引:30
|
作者
Liu, Yuan [1 ,2 ,3 ]
Dai, Jinyue [1 ,3 ]
Liu, Xiaoqing [1 ,3 ,4 ]
Luo, Jun [2 ]
You, Shusen [1 ,3 ,4 ,5 ]
Zhu, Jin [4 ,5 ]
Ma, Songqi [4 ,5 ]
Jia, Zhen [6 ,7 ]
机构
[1] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Polymer & Composites Div, Ningbo 315201, Zhejiang, Peoples R China
[2] Guiyang Univ, Engn Res Ctr Mat Protect Wear & Corros Guizhou Pr, Guiyang 550005, Guizhou, Peoples R China
[3] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
[4] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Polymer & Composites Div, Ningbo 315201, Peoples R China
[5] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
[6] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Peoples R China
[7] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
基金
中国国家自然科学基金;
关键词
eugenol; biomass; bio-based epoxy resin; low dielectric constant; ELECTRONIC PACKAGING APPLICATIONS; COMPOSITES; LIGNIN; PERFORMANCE; SILOXANE; ADHESIVE; BEHAVIOR; MICRO;
D O I
10.1115/1.4036818
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4'-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance (H-1-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1 kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 degrees C and higher residues at 800 degrees C than that of DGEBA.
引用
收藏
页数:7
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