A comparison of impression and compression creep behavior of polycrystalline Sn

被引:33
|
作者
Park, C.
Long, X.
Haberman, S.
Ma, S.
Dutta, I. [1 ]
Mahajan, R.
Jadhav, S. G.
机构
[1] USN, Postgrad Sch, Dept Mech & Astronaut Engn, Ctr Mat Sci & Engn, Monterey, CA 93940 USA
[2] Intel Corp, Assembly Technol Dev, Chandler, AZ 85226 USA
关键词
D O I
10.1007/s10853-006-0542-5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper reports on the application of a miniaturized impression creep test to measure the creep behavior of pure polycrystalline Sn, and compares the results to compression creep data on the same sample, in order to experimentally determine a scaling constant to formulate the equivalent uniaxial creep constitutive law from the impression creep data. The creep parameters determined via impression and compression creep are found to be identical, with n similar to 5 and Q similar to 42 kJ/mol, indicating that over the tested stress-temperature range, the mechanism is core diffusion controlled dislocation creep. In conjunction with results from previous modeling work, a single conversion factor, K-n/C, which depends on material properties, is shown to be usable for converting the impression creep relation to the equivalent uniaxial creep relation, and the experimentally determined value of k(n)/C for polycrystalline Sn is very close to that obtained via modeling.
引用
收藏
页码:5182 / 5187
页数:6
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