Using life-cycle information for reliability assessment of electronic assemblies

被引：0
|
作者：
Middendorf, A [1 ]
Griese, H [1 ]
Reichl, H [1 ]
Grimm, WM [1 ]
机构：
[1] Tech Univ Berlin, D-13355 Berlin, Germany
来源：
2002 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP - FINAL REPORT | 2002年
关键词：
life-time information module; reliability;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes the modular concept of a Lifetime Information Module (LIM) for reliability assessment and lifetime estimation of electronic components. The LIM consists of a data logger and a data processing setup for computing the reliability of individual electronic products, which are subject to different use conditions. It is designed for realizing novel failure prediction and lifetime estimation methods.
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页码：176 / 179
页数：4
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