Pulsed Potential Dissolution Reduces Anode Residue Formation during Nickel Electroplating

被引:4
|
作者
Barlow, Burke C. [1 ]
Szymanski, Grzegorz [2 ]
Lipkowski, Jacek [2 ]
Shobeir, Babak [3 ]
Love, Bruce [3 ]
Burgess, Ian J. [1 ]
机构
[1] Univ Saskatchewan, Dept Chem, Saskatoon, SK S7N 5C9, Canada
[2] Univ Guelph, Dept Chem, Guelph, ON N1G 2W1, Canada
[3] Vale Base Met Technol Dev, Mississauga, ON L5K 1Z9, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
SCANNING-TUNNELING-MICROSCOPY; COOPERATIVE STOCHASTIC-BEHAVIOR; SULFUR-MODIFIED NI(100); STAINLESS-STEEL; LOCALIZED CORROSION; PITTING CORROSION; POWDER PARTICLES; THIN-FILMS; GRAIN-SIZE; PIT GROWTH;
D O I
10.1149/2.0431605jes
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The electrodissolution of nickel pellets with different controlled electrical variables was investigated in an effort to mitigate anodic residue in Watts bath based electroplating cells. During galvanostatic dissolution the anode potential was seen to oscillate between passive and transpassive (pitting) potentials. In-situ microscopy and ex-situ characterization has shown that lacy-pit formation and large, partially perforated, pit covers formed during galvanostatic potential decay and contributed significantly to anode residue. Constant potential measurements at high potentials reduced the anode residue but require large power consumption. Current transients during potentiostatic pulses were analyzed and the critical time where pit propagation changed from superficial to quasi-hemispherical was determined. An alternative method of anode dissolution was devised using potential pulses and duty cycles that allowed average current densities comparable to industrial plating conditions to be achieved. By restricting the time spent at large positive potentials to 50 ms, anode residue was reduced more than six-fold in comparison to an equivalent galvanostatic dissolution run at a comparable current density. (C) 2016 The Electrochemical Society. All rights reserved.
引用
收藏
页码:C164 / C170
页数:7
相关论文
共 20 条
  • [1] PTFE layer formation during brush electroplating of nickel
    Isern, L.
    Impey, S.
    Almond, H.
    Clouser, S. J.
    Endrino, J. L.
    SCIENTIFIC REPORTS, 2024, 14 (01):
  • [2] Electrochemical Dissolution Behavior and the Residue Formation Mechanism of Laboratory Made Carbonyl Nickel
    Moula, M. G.
    Szymanski, G.
    Shobeir, B.
    Huang, H.
    Burgess, I. J.
    Chen, A.
    Lipkowski, J.
    ELECTROCHIMICA ACTA, 2015, 162 : 108 - 118
  • [3] Phase formation during dissolution of nickel in liquid aluminum
    CEA-CEREM, Fontenay-aux-Roses, France
    Z Metallkd, 6 (446-451):
  • [4] Phase formation during dissolution of nickel in liquid aluminium
    Bouche, K
    Barbier, F
    Coulet, A
    ZEITSCHRIFT FUR METALLKUNDE, 1997, 88 (06): : 446 - 451
  • [5] PIT AND FLOW STREAK FORMATION DURING HIGH-RATE DISSOLUTION OF NICKEL
    DATTA, M
    LANDOLT, D
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (09) : 1889 - 1895
  • [6] POTENTIAL FORMATION OF COMPLEX HYDRIDE FORMATION DURING THE HYDRATION OF MAGNESIUM-NICKEL ALLOYS
    YABLOKOV, YS
    PROKOFEV, AI
    KHIMICHESKAYA FIZIKA, 1992, 11 (09): : 1259 - 1264
  • [7] Film formation during pulsed laser ablation of nickel-palladium composite targets
    A. G. Bagmut
    I. G. Shipkova
    V. A. Zhuchkov
    Technical Physics Letters, 2010, 36 : 371 - 374
  • [8] Film formation during pulsed laser ablation of nickel-palladium composite targets
    Bagmut, A. G.
    Shipkova, I. G.
    Zhuchkov, V. A.
    TECHNICAL PHYSICS LETTERS, 2010, 36 (04) : 371 - 374
  • [9] Improving Spatial Confinement of Anodic Dissolution of Heat-Resistant Chromium−Nickel Alloys during Pulsed Electrochemical Machining
    S. A. Silkin
    E. N. Aksenov
    E. A. Likrizon
    V. I. Petrenko
    A. I. Dikusar
    Surface Engineering and Applied Electrochemistry, 2019, 55 : 493 - 501
  • [10] Improving Spatial Confinement of Anodic Dissolution of Heat-Resistant Chromium-Nickel Alloys during Pulsed Electrochemical Machining
    Silkin, S. A.
    Aksenov, E. N.
    Likrizon, E. A.
    Petrenko, V. I.
    Dikusar, A. I.
    SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY, 2019, 55 (05) : 493 - 501