The development of eco-friendly, non-formaldehyde, and high-performance bio-based adhesives is a great strategy for relieving environmental pressure and health concern, especially for the wood adhesive industry. In this work, a green soybean meal (SM)-based adhesive with excellent performance was developed by embedding modified kenaf fibers (KF). The synergistic bionic design with gecko structure and mussel chemistry endowed KF with improved rough surface and increased reactive sites, resulting in robust mechanical interlocking and multiple chemical crosslinking ability for SM-based adhesive. The resultant adhesive exhibited excellent bonding properties, compared to the SM adhesive, the wet shear strength was improved from 0.41 MPa to 1.52 MPa, and the moisture absorption was decreased from 10.1% to 8.6%. These results met the standard of type II plywood (>= 0.7 MPa) according to the national standard of China (GB/T 9846.3-2004). This eco-friendly SM-based adhesive opens a new way to replace harmful formaldehyde-based adhesives and contributes to the development and use of agricultural and forestry byproducts for practical application. (C) 2019 Elsevier Ltd. All rights reserved.
机构:
Univ Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USAUniv Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USA
Lincoln, John D.
Earthman, James C.
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机构:
Univ Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USAUniv Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USA
Earthman, James C.
Ogunseitan, Oladele A.
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机构:
UCI, Coll Hlth Sci, Publ Hlth Program, Irvine, CA USA
UCI, Dept Environm Hlth Sci Policy, Program Ind Ecol, Irvine, CA USAUniv Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USA
Ogunseitan, Oladele A.
Saphores, Jean-Daniel M.
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机构:
UCI, Dept Civil Environm Engn, Irvine, CA USAUniv Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USA
Saphores, Jean-Daniel M.
Shapirc, Andrew A.
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机构:
UCI, Dept Elect Engn & Comp Sci, Irvine, CA USAUniv Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USA
Shapirc, Andrew A.
[J].
PROCEEDINGS OF THE 2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS & THE ENVIRONMENT, CONFERENCE RECORD,
2007,
: 190
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