Automatic 3-D Modeling of Integrated Power Amplifier by APDL

被引：0

作者：

Lin, Qian ^{[1
]}

Zhao, Peng-Fei ^{[1
]}

Wu, Hai-Feng ^{[2
]}

Chen, Si-Wei ^{[1
]}

机构：

[1] Qinghai MinZu Univ, Coll Phys & Elect Informat Engn, Xining 810007, Qinghai, Peoples R China

[2] Chengdu Ganide Technol, Chengdu, Peoples R China

来源：

2022 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT) | 2022年

关键词：

automatic 3-D model; ANSYS Parameter Design Language (APDL); power amplifier (PA); INTERCONNECT RELIABILITY-ANALYSIS;

D O I：

10.1109/ICMMT55580.2022.10023311

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Aiming at the disadvantages of complexity and low efficiency of the traditional finite element modeling, the ANSYS Parameter Design Language (APDL)modeling is used to realize the automatic 3-D modeling of a GaN monolithic microwave integrated circuit (MMIC) PA in this paper. By executing the APDL program, the 3-D model can be constructed in few seconds. The modeling results show, that this method only takes 47 seconds and 49 KB for modeling, comparing to the traditional method, which needs about several hours. Furthermore, it can overcome the shortness of time-consuming and resource-consuming for the finite element analyils(FEA). Meanwhile, it is convenient for model revision and important for the interconnect reliability analysis, which facilitates the automatic 3-D modeling for MMIC.

引用

页数：3

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