A flexible dual-mode proximity sensor based on cooperative sensing for robot skin applications

被引:23
|
作者
Huang, Ying [1 ]
Cai, Xia [1 ]
Kan, Wenqing [1 ]
Qiu, Shihua [1 ]
Guo, Xiaohui [1 ]
Liu, Caixia [1 ]
Liu, Ping [1 ]
机构
[1] Hefei Univ Technol, Sch Elect Sci & Appl Phys, Hefei 230009, Anhui, Peoples R China
来源
REVIEW OF SCIENTIFIC INSTRUMENTS | 2017年 / 88卷 / 08期
基金
中国国家自然科学基金;
关键词
TEMPERATURE-COEFFICIENT; ELECTRICAL-PROPERTIES; FILM; DEPENDENCE; RESISTANCE; GRAPHENE; DESIGN; ARRAY;
D O I
10.1063/1.4998995
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
A flexible dual-mode proximity sensor has been designed and implemented, which is capable of combining capacitive-resistive detection in this paper. The capacitive type proximity sensor detecting is defined as mode-C, and the resistive type proximity sensor detecting is defined as mode-R. The characteristics of the proximity sensor are as follows: (1) the theoretical mode is developed which indicates that this proximity sensor can reflect proximity information accurately; (2) both sensing modes are vertically integrated into a sandwich-like chip with an 8 mm x 12 mm unit area. The thickness of a mode-R sensing material (graphene nanoplatelets) and mode-C dielectric (the mixture of carbon black and silicone rubber) is 1 mm and 2.5 mm, respectively; (3) for mode-R, the linearity of temperature-resistance curve can achieve 0.998 in the temperature range from 25 degrees C to 65 degrees C. And for mode-C, various materials can be successfully detected with fast response and high reversibility. Meanwhile, the study compensated the influence of object temperature to ensure mode-C properly works. A cooperative sensing test shows that R-C dual modes sense effectively which can enlarge the sensing distance compared with the single mode proximity sensor. The fabrication of this sensor is convenient, and the integrity of a flexible sandwich-like structure based on dual modes is beneficial to form arrays, which is suitable to be used in skin-like sensing applications.Published by AIP Publishing.
引用
收藏
页数:7
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