A TLM-SPICE interconnection framework for coupled field and circuit analysis in the time domain

被引：11
|
作者：
Poman, PM [1 ]
Wolfgang, JR [1 ]
机构：
[1] Univ Victoria, Computat Electromagnet Res Lab, Dept Elect & Comp Engn, Victoria, BC V8W 3P6, Canada
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2002年 / 50卷 / 12期
关键词：
active devices and hybrid SPICE-transmission-line matrix (SPICE-TLM) connection; distributed device embedding; lumped device embedding; nonlinear devices; time-domain modeling; transmission-line matrix (TLM) method;
D O I：
10.1109/TMTT.2002.805199
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A general SPICE-transmission-line matrix (TLM) interconnection framework has been developed. The connection algorithm is based on the representation of the TLM network by equivalent Thevenin and/or Norton sources. Fundamental issues such as source equivalence and SPICE-TLM interconnection options have been examined. The framework opens new and far-reaching possibilities for hybrid global microwave and high-speed digital circuit modeling in the time domain because it combines the extensive circuit and device models of SPICE with general three-dimensional field solutions.
引用
收藏
页码：2728 / 2733
页数：6
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