Development of texture and morphology in Cu-Ag thin nanocomposite films on Si

被引：0

作者：

Misjak, F. ^{[1
]}

Horvath, Z. E. ^{[1
]}

Barna, P. B. ^{[1
]}

Radnoczi, G. ^{[1
]}

机构：

[1] Hungarian Acad Sci, MFA, Res Inst Tech Phys & Mat Sci, H-1525 Budapest, Hungary

来源：

PROCEEDINGS OF THE 17TH INTERNATIONAL VACUUM CONGRESS/13TH INTERNATIONAL CONFERENCE ON SURFACE SCIENCE/INTERNATIONAL CONFERENCE ON NANOSCIENCE AND TECHNOLOGY | 2008年 / 100卷

关键词：

D O I：

10.1088/1742-6596/100/8/082008

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Cu-Ag films were deposited in vacuum of 10(-5)-10(-6) mbar onto freshly cleaned Si wafers. The composition of the films corresponded to Cu, Cu(9)Ag(1), Cu(4)Ag(6) and Ag. The films were investigated by X-ray diffraction and pole figures of < 111 > and < 100 > directions were recorded. TEM and XTEM were used to determine the morphological properties of the films. We found that Ag modifies the interaction of Cu with the Si substrate. Low amounts of Ag are enhancing the formation of the biaxial < 100 > texture of Cu. Larger amounts of Ag result in the formation of < 111 > wire texture of both Ag and Cu components.

引用

页数：4

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