Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment

被引：4

作者：

Bae, Byung-Hyun ^{[1
]}

Lee, Hyeonchul ^{[2
]}

Kim, Gahui ^{[3
]}

Son, Kirak ^{[3
]}

Park, Young-Bae ^{[3
]}

机构：

[1] VITZROTECH Co Ltd, 327 Byeolmang Ro, Ansan 15603, Gyeonggi Do, South Korea

[2] STATS ChipPAC Korea LTD, 191 Jayumuyeok Ro, Incheon 22379, South Korea

[3] Andong Natl Univ, Sch Mat Sci & Engn, 1375 Gyeongdong Ro, Andong Si 36729, Gyeongsangbuk D, South Korea

来源：

ELECTRONIC MATERIALS LETTERS | 2021年 / 17卷 / 02期

关键词：

Flexible printed circuit board; Peel test; Temperature; humidity; Screen-printed ag; Polyimide; ELECTROLESS-PLATED NI; AG NANOPARTICLES; SILVER; ENERGY; FILM; CONDUCTIVITY; LITHOGRAPHY; ALLOY; UV;

D O I：

10.1007/s13391-021-00272-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effect of temperature/humidity (T/H) treatment at 85 celcius/85% relative humidity (R.H.) on the peel strength between screen-printed Ag/polyimide (PI) substrate was evaluated using a 180 degrees peel test. Initial peel strength was 22.22 +/- 1.00 gf/mm, and then decreased to 0.47 +/- 0.22 gf/mm after 500 h at 85 celcius/85% R.H. treatment condition. And, the peeled locus was changed from Ag/PI interface to mixed mode of Ag/PI interface and shallow cohesive inside PI near Ag/PI interface. The decrease in peel strength during T/H treatment is related to formation of weak boundary layer inside PI near Ag/PI interface by hydrolytic degradation of PI due to long-term moisture penetration into the Ag/PI interface.

引用

页码：157 / 163

页数：7

共 28 条

[1] Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment
Byung-Hyun Bae
Hyeonchul Lee
Gahui Kim
Kirak Son
Young-Bae Park
Electronic Materials Letters, 2021, 17 : 157 - 163
[2] Effects of Environmental Conditions on Interfacial Adhesion Between Screen-Printed Ag Film and Polyimide Substrate
Lee, Hyeonchul
Bae, Byung-Hyun
Kim, Gahui
Son, Kirak
Kim, Byoung-Joon
Park, Young-Bae
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2020, 20 (01) : 206 - 212
[3] Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion Energy between Inkjet-Printed Ag and Polyimide
Park, Sung-Cheol
Park, Young-Bae
JAPANESE JOURNAL OF APPLIED PHYSICS, 2009, 48 (08) : 08HL021 - 08HL026
[4] Effect of temperature/humidity treatment conditions on the interfacial adhesion energy of inkjet printed ag film on polyimide
Park, Sung-Cheol
Cho, Su-Hwan
Jung, Hyun-Cheol
Joung, Jae-Woo
Park, Young-Bae
JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, 2007, 45 (09): : 520 - 526
[5] Effects of Plasma Polymerized Acrylic Acid Film on the Adhesion of Ag Tracks Screen-Printed on Polyimide
Kim, Kwang-Seok
Myung, Woo-Ram
Jung, Seung-Boo
JOURNAL OF ADHESION, 2012, 88 (4-6): : 337 - 349
[6] Effects of plasma polymerized acrylic acid film on the adhesion of Ag tracks screen-printed on polyimide
Jung, S.-B. (sbjung@skku.ac.kr), 1600, Taylor and Francis Inc. (88): : 4 - 6
[7] Effect of Atmospheric-Pressure Plasma Treatment on the Adhesion Characteristics of Screen-Printed Ag Nanoparticles on Polyimide
Park, Bum-Geun
Kim, Kwang-Seok
Jung, Kwang-Ho
Jung, Seung-Boo
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2014, 14 (12) : 9448 - 9453
[8] Influence of firing temperature on interface adhesion between screen-printed Ag film and BaTiO3 substrate
Lee, Chao-Yu
Dupeux, Michel
Tuan, Wei-Hsing
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 467 (1-2): : 125 - 131
[9] Adhesion Characteristics of Silver Tracks Screen-Printed on Polyimide with an Environmental Reliability Test
Kim, Kwang-Seok
Myung, Woo-Ram
Jung, Seung-Boo
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2012, 12 (07) : 5769 - 5773
[10] Soldering surface mount components on screen-printed Ag patterns on paper and polyimide substrates for hybrid printed electronics
Li, Xiaotian
Andersson, Henrik
Siden, Johan
Schon, Thomas
FLEXIBLE AND PRINTED ELECTRONICS, 2018, 3 (01):

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