Performance of microbolometer focal plane arrays under varying pressure

被引:28
|
作者
He, X [1 ]
Karunasiri, G
Mei, T
Zeng, WJ
Neuzil, P
Sridhar, U
机构
[1] Natl Univ Singapore, Dept Elect Engn, Singapore 119260, Singapore
[2] Inst Microelect, Singapore 117685, Singapore
关键词
FPA; microbolometer; infrared; pressure dependence; thermal conductance;
D O I
10.1109/55.841306
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this letter, we present a study of imaging using a 128 x 128-pixel microbolometer focal plane array (FPA) under varying pressure conditions from 10(-5) torr to the ambient, We have employed bulk micromachining in the fabrication of FPA to reduce the thermal conduction through the air-gap between the membrane and the substrate of the microbolometers. it was found that an image of a soldering iron (200 degrees C) was clearly visible even at the ambient pressure. However, at ambient pressure, the increased in thermal conductance resulted in a reduction of contrast of the image compared to the ones obtained at low pressure. The results suggest the possibility of operation of uncooled FPA's under ambient pressure by proper design of the microbolometer structure.
引用
收藏
页码:233 / 235
页数:3
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