Derivation of tensile flow properties of thin films using nanoindentation technique

被引:19
|
作者
Ahn, JH
Jeon, EC
Choi, Y [1 ]
Lee, YH
Kwon, D
机构
[1] Seoul Natl Univ, Sch Mat Sci & Engn, Seoul 151742, South Korea
[2] Seoul Natl Univ, FRONT Inc, Res Inst Adv Mat, Seoul 151742, South Korea
关键词
nanoindentation technique; Au thin films; pile up/sink-in; Flow properties;
D O I
10.1016/S1567-1739(02)00155-4
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
By regarding the tip blunting as a ball indentation at very low depth range (within about 80 nm in our experiments), the flow properties of Au thin films were derived from the indentation load-depth curve obtained by nanoindentation technique. The effects of pile-up or sink-in were considered in determining the real contact between the indenter and the specimen. The representative strain in indentation was defined in various ways and examined by comparing the flow properties derived from indentation load-depth curve with those measured by tensile test. The best definition was found to be the shear strain at contact edge multiplied by 0.1. When we considered the effects of pile-up or sink-in. the representative stress in indentation could also be determined, and was found to be one third of the mean contact pressure for fully plastic regime. As a more intrinsic property than hardness, the yield strengths of Au films with thickness of 0.56 and 0.99 mum were extrapolated from the derived trite stress-true strain curve as 261 +/- 30 and 154 +/- 18 MPa, respectively. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:525 / 531
页数:7
相关论文
共 50 条
  • [1] Characterization of mechanical properties of thin films using nanoindentation technique
    Li, Heqing
    Cai, Xun
    Chen, Qiulong
    2001, Editorial Office of Transactions of Materials and Heat Treatment (22):
  • [2] Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique
    Fang, TH
    Chang, WJ
    MICROELECTRONIC ENGINEERING, 2003, 65 (1-2) : 231 - 238
  • [3] Measurements of mechanical properties of thin polymer films by nanoindentation technique
    Hur, S
    Hong, SI
    Lee, HJ
    Han, SW
    Kim, JH
    Kang, JY
    Choi, BI
    Oh, CS
    ADVANCES IN NONDESTRUCTIVE EVALUATION, PT 1-3, 2004, 270-273 : 1107 - 1112
  • [4] Mechanical properties of thin Ag films on a silicon substrate studied using the nanoindentation technique
    A. V. Panin
    A. R. Shugurov
    K. V. Oskomov
    Physics of the Solid State, 2005, 47 : 2055 - 2059
  • [5] Mechanical properties of thin Ag films on a silicon substrate studied using the nanoindentation technique
    Panin, AV
    Shugurov, AR
    Oskomov, KV
    PHYSICS OF THE SOLID STATE, 2005, 47 (11) : 2055 - 2059
  • [6] Characterization of elastic moduli of Cu thin films using nanoindentation technique
    Hong, SH
    Kim, KS
    Kim, YM
    Hahn, JH
    Lee, CS
    Park, JH
    COMPOSITES SCIENCE AND TECHNOLOGY, 2005, 65 (09) : 1401 - 1408
  • [7] Elastic-plastic characterization of thin films using nanoindentation technique
    Shan, ZH
    Sitaraman, SK
    THIN SOLID FILMS, 2003, 437 (1-2) : 176 - 181
  • [8] Characterisation of TiN thin films using the bulge test and the nanoindentation technique
    Karimi, A
    Shojaei, OR
    Kruml, T
    Martin, JL
    THIN SOLID FILMS, 1997, 308 : 334 - 339
  • [9] Characterization of mechanical properties of thin films using nanoindentation test
    Pelletier, Herve
    Krier, Joel
    Mille, Pierre
    MECHANICS OF MATERIALS, 2006, 38 (12) : 1182 - 1198
  • [10] Elastic and plastic properties of electroplated thin films and layered nanocomposites by nanoindentation technique
    Haseeb, ASMA
    Celis, JP
    Roos, JR
    TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 1999, 52 (06): : 423 - 426