Grain and subgrain boundaries in ultrafine-grained materials

被引：28
|
作者：
Saxl, Ivan [1 ]
Kalousova, Anna [2 ]
Ilucova, Lucia [1 ]
Sklenicka, Vaclav [3 ]
机构：
[1] Acad Sci Czech Republic, Math Inst, CZ-11567 Prague 1, Czech Republic
[2] Fel Cvut, CZ-16627 Prague, Czech Republic
[3] Acad Sci Czech Republic, Inst Phys Mat, CZ-61662 Brno, Czech Republic
来源：
MATERIALS CHARACTERIZATION | 2009年 / 60卷 / 10期
关键词：
Grain boundaries; ECAP; Aluminium; Copper; ECAP ALUMINUM; MICROSTRUCTURE; CREEP;
D O I：
10.1016/j.matchar.2009.03.010
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The attractive metallographic electron backscatter diffraction (EBSD) method is used to describe the effect of the number N of passes on the subgrain and grain structures of pure aluminium and copper processed by equal channel angular pressing (ECAP). The remarkable feature of the aluminium structure is the lack of high angle boundaries after a low number (N = 2, 4) of passes and this remains preserved even after a relatively long annealing time. On the other hand, the boundary structure of copper is relatively stable and high angle boundaries always prevail. (C) 2009 Elsevier Inc. All rights reserved.
引用
收藏
页码：1163 / 1167
页数：5
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