Process control for solder paste deposition

被引：0
|
作者：
Owen, M [1 ]
Hawthorne, J [1 ]
机构：
[1] MV Technol LTD, Beaverton, OR USA
来源：
SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM | 1999年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
A review or solder paste inspection, including the motivation for inspecting solder paste, the sensor technologies used to acquire 2D/3D inspection and measurement data, methods of using measurement data to identify problems and appropriate corrective actions, and guidance on developing an AOI strategy that matches product technology, throughput, and mix.
引用
收藏
页码：488 / 493
页数：6
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