A Low-Loss Balun-Embedded Interconnect for THz Heterogeneous System Integration

被引：0

作者：

Chiu, Te-Yen ^{[1
]}

Lee, Yu-Ling ^{[2
]}

Ko, Chun-Lin ^{[3
]}

Tseng, Sheng-Hsiang ^{[3
]}

Li, Chun-Hsing ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Engn & Syst Sci, Hsinchu, Taiwan

[2] Atom Element Matter BV, Amsterdam, Netherlands

[3] Natl Appl Res Labs, Taiwan Semicond Res Inst, Hsinchu, Taiwan

来源：

PROCEEDINGS OF THE 2020 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2020年

关键词：

heterogeneous integration; interconnect; low-loss; Marchand balun; THz;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An interconnect for THz heterogeneous integration is proposed in this work. Two transmission lines deployed on a 40nm CMOS chip and an IPD carrier, respectively, are coupled together to form a Marchand balun during a flip-chip packaging process. By doing this, the proposed interconnect can provide packaging and balun functions simultaneously. Two interconnects using the proposed idea are demonstrated with measured and simulated insertion loss of 0.9 and 1.4 dB at 169 and 340 GHz, respectively.

引用

页码：1043 / 1046

页数：4

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