An Active Junction Temperature Control Method Based on Thermoelectric Coolers

Thermal stress caused by junction temperature fluctuations is one of the main factors reducing the reliability of the power semiconductor devices. Hence, in order to reduce the severe junction temperature fluctuation, this paper proposed a novel active junction temperature control method based on thermoelectric coolers (TEC). Firstly, the thermal model of the inverter-TEC system was established. Secondly, a hysteresis loop junction temperature control method was proposed. Then, TEC power consumption and the efficiency of the inverter-TEC system were analyzed. Finally, a simulation was implemented and results verified the proposed method. The maximum junction temperature fluctuation is reduced significantly by 65.4% in Urban Dynamometer Driving Schedule (UDDS) condition. Meanwhile, the average junction temperature is dropped by 5.96%. Therefore, the lifetime of power devices can be extended.