Modeling of Planar Coils for Wireless Power Transfer Systems Including Substrate Effects

被引:0
|
作者
Pagano, Rosario [1 ]
Abedinpour, Siamak [1 ]
Raciti, Angelo [2 ]
Musumeci, Salvatore [2 ]
机构
[1] Integrated Device Technol, Analog & Power Div, 1140 W Warner Rd, Tempe, AZ 85224 USA
[2] Univ Catania, Dept Elect Elect & Comp Engn, Viale A Doria 6, I-95125 Catania, Italy
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents an analytical model of the impedance between two coils supported by ferrite shield. The new model is not restricted to round coils and applies to more complex winding geometries, as specified by the Wireless Power Consortium. The mutual inductance is derived by solving Maxwell's equations and using Bessel function of the first kind. The model results are compared with experimental data as a function of the vertical displacement between the coils. In addition, a wireless power transfer system is modeled to calculate system efficiency by adopting the above coils impedance model. Experimental results run on SW wireless power transfer system at several displacement steps are compared against simulation data.
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页码:1129 / 1136
页数:8
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