Growth behavior of intermetallic compound on bonding joint of Cu wire on Al alloy pad during thermal aging

被引：0

作者：

Xu Hui ^{[1
]}

Wang Chunqing ^{[1
]}

Hang Chunjin ^{[1
]}

机构：

[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China

来源：

ACTA METALLURGICA SINICA | 2007年 / 43卷 / 02期

关键词：

copper ball bonding; intermetallics compound (IMC); aging; micro-XRD;

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Copper wire of 50 mu m in diameter was bonded to the Al-1%Si-0.5%Cu pad successfully by thermosonic wire bonding. SEM, EDXS and micro-XRD were adopted to investigate the intermetallic compounds (IMC) at the interface of wire and pad. The results show that the major IMC are CuAl2 and Cu9Al4, Cu-Al IMC growth followed the parabolic law as a function of aging times at certain aging temperatures and the activation energy of Cu-Al IMC growth was 97.1 kJ/mol.

引用

页码：125 / 130

页数：6

共 11 条

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