Interfacial microstructure of Pb-free and Pb-Sn solder balls in the ball-grid array package

被引：6
|
作者：
Chi, CS [1 ]
Chang, HS
Hsieh, KC
Chung, CL
机构：
[1] Natl Sun Yat Sen Univ, Inst Mat Sci & Engn, Kaohsiung 80424, Taiwan
[2] ChipMOS Technol Inc, Assy Tech Dev Div, Tainan, Taiwan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 11期
关键词：
Sn-3.5Ag solder; BGA; reliability; interface reaction;
D O I：
10.1007/s11664-002-0011-0
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Ball-grid array (BGA) samples were aged at 155degreesC up to 45 days. The formation and the growth of the intermetallic phases at the solder joints were investigated. The alloy compositions of solder balls included Sn-3.5Ag-0.7Cu, Sn-1.0Ag-0.7Cu, and 63Sn-37Pb. The solder-ball pads were a copper substrate with an Au/Ni surface finish. Microstructural analysis was carried out by electron microprobe. The results show that a ternary phase, (Au,Ni)Sn-4, formed with Ni3Sn4 in the 63Sn-37Pb solder alloy and that a quaternary intermetallic phase, (Au,Ni)(2)Cu3Sn5, formed in the Sn-Ag-Cu solder alloys. The formation mechanism of intermetallic phases was associated with the driving force for Au and Cu atoms to migrate toward the interface during aging.
引用
收藏
页码：1203 / 1207
页数：5
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