Delamination behavior of an end-linked PDMS/copper interface: a molecular dynamics study

被引：0

作者：

Wang, Wenjia ^{[1
]}

Pan, Kailin ^{[1
]}

Li, Tingting ^{[1
]}

Han, Xufeng ^{[1
]}

Cao, Weiwu ^{[1
]}

Gong, Siming ^{[1
]}

Wang, Wenhui ^{[1
]}

Fan, Kai ^{[1
]}

机构：

[1] Guilin Univ Elect Technol, Sch Mech & Elect Engn, Guilin, Peoples R China

来源：

2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2017年

基金：

美国国家科学基金会;

关键词：

molecular dynamics; polydimethylysiloxane; copper substrate; delamination behavior; interface; CROSS-LINKING; EPOXY; SIMULATION; NETWORKS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the delamination behavior of an end-linked PDMS/copper interface is investigated through molecular dynamics simulations. A stepwise end-linking protocol based on an iterative MD simulation/energy minimization is utilized to develop the post-cured microstructure of the PDMS. Stress versus strain relation is calculated to understand the PDMS/copper interfacial tensile strength and thus to predict the interface delamination behavior. The resulted stress-strain relations can be also applied in cohesive zone finite element simulation to evaluate stretchability of stretchable interconnects.

引用

页码：1542 / 1546

页数：5

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