Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material

In this study, a heat management module containing a microencapsulated phase change material (mPCM) was fabricated from mPCM (core material: paraffin; melting temperature: 37 degrees C) and aluminum honeycomb structures (8 mm core cell). The aluminum honeycomb functioned both as structural support and as a heat transfer channel. The thermal management performance of the proposed module under constant-temperature boundary conditions was investigated experimentally. The thermal protection period of the module decreased as the Stefan number increased; however, increasing the subcooling factor could effectively enhance the thermal protection performance. When the cold-wall temperature T-C was fixed at 17 degrees C and the initial hot wall temperature was 47-67 degrees C, the heat dissipation of the module was complete 140 min after the hot-wall heat supply was stopped. The time required to complete the heat dissipation increased to 280 min when T-C increased to 27 degrees C.