Reliability test and failure analysis of optical MEMS

被引:4
|
作者
Dürr, P [1 ]
Dauderstädt, U [1 ]
Kunze, D [1 ]
Auvert, M [1 ]
Lakner, H [1 ]
机构
[1] Fraunhofer Inst Microelect Circuits & Syst, FhGIMS, D-01109 Dresden, Germany
关键词
optical MEMS; spatial light modulator; DUV; lifetime test;
D O I
10.1109/IPFA.2002.1025660
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Modem UV-lithography is searching for new highly parallel writing concepts. Spatial light modulation (SLM) with optical MEMS devices offers such possibilities. Special emphasis must be put on the ability of SLM devices to handle ultraviolet light (UV). For deep UV laser mask writing (248 nm) we designed and fabricated a 2048x512 pixel optical MEMS with individually addressable aluminum micro-mirrors. In order to support the small volume production and the qualification of such devices we have set up test and characterization systems for failure analysis and lifetime testing. In order to ensure a high quality of the optical MEMS e.g. a map of the device under test is needed showing the exact position of defective pixels together with the type of defect like not responding, always deflected, wrong spring constant, or poorly reflecting surface. Additionally information on the flatness of the mirrors and on their lifetime under UV pulsed illumination are required. This paper describes the concepts of our test systems, their experimental realization, and results obtained for our optical MEMS chips.
引用
收藏
页码:201 / 206
页数:6
相关论文
共 50 条
  • [1] Optical methods for the reliability and failure analysis of RF MEMS
    van Spengen, W. M.
    De Wolf, I.
    [J]. Proceedings of ISMA 2004: International Conference on Noise and Vibration Engineering, Vols 1-8, 2005, : 2347 - 2360
  • [2] Performance and reliability test of MEMS optical scanners
    Kurth, Steffen
    Kaufmann, Christian
    Hahn, Ramon
    Mehner, Jan
    Doetzel, Wolfram
    Gessner, Thomas
    [J]. RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS VI, 2007, 6463
  • [3] Reliability and failure analysis of MEMS/NEMS switches
    Lee, Chengkuo
    [J]. PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2016, : 408 - 413
  • [4] The reliability of RF-MEMS: failure modes, test procedures and instrumentation
    De Wolf, I
    [J]. RELIABILITY, TESTING AND CHARACTERIZATION OF MEMS/MOEMS III, 2004, 5343 : 1 - 8
  • [5] MEMS reliability, characterization and test
    Hartzell, A
    Woodilla, D
    [J]. RELIABILITY, TESTING AND CHARACTERIZATION OF MEMS/MOEMS, 2001, 4558 : 1 - 5
  • [6] Instrumentation and methodology for MEMS testing, reliability assessment and failure analysis
    De Wolf, I
    [J]. 2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2, 2004, : 57 - 63
  • [7] System Reliability Analysis of MEMS Gyroscope with Multiple Failure Modes
    Feng, Hengzhen
    Lou, Wenzhong
    Wang, Dakui
    Zheng, Fuquan
    Liao, Maohao
    [J]. PROCEEDINGS OF 2018 10TH INTERNATIONAL CONFERENCE ON MODELLING, IDENTIFICATION AND CONTROL (ICMIC), 2018,
  • [8] A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test
    Kang, Qiaoqiao
    Lin, Yuzhe
    Tao, Jifang
    [J]. SENSORS, 2023, 23 (21)
  • [9] Optical MEMS: Designing for reliability
    Bhattacharya, Shanti
    [J]. RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS VI, 2007, 6463
  • [10] Reliability assessment and failure mode analysis of MEMS accelerometers for space applications
    Marozau, I.
    Auchlin, M.
    Pejchal, V.
    Souchon, F.
    Vogel, D.
    Lahti, M.
    Saillen, N.
    Sereda, O.
    [J]. MICROELECTRONICS RELIABILITY, 2018, 88-90 : 846 - 854