Etching of polysilicon in inductively coupled Cl2 and HBr discharges.: IV.: Calculation of feature charging in profile evolution

被引:20
|
作者
Mahorowala, AP [1 ]
Sawin, HH [1 ]
机构
[1] MIT, Dept Chem Engn, Cambridge, MA 02139 USA
来源
关键词
D O I
10.1116/1.1481869
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The ability to simulate feature charging was added to the Monte Carlo profile evolution simulator described in the companion article of this series [A. P. Mahorowala and H. H. Sawin, J. Vac. Sci. Technol. B 20, 1077 (2002)]. Two electrical assumptions were compared: (1) a perfect insulating feature and (2) a resistive feature. The potential profiles for the entire feature were generated and the ion and electron fluxes were computed along the feature surface, The resistive feature representation enabled the incorporation of bulk conduction and surface leakage that is not possible when using the insulator approximation. For highly resistive surfaces, the solutions for the two assumptions were shown to converge. With the insulator approximation, the potential profiles were calculated by determining the accumulated charge on the feature surface and solving Poisson's equation over the entire simulation domain. Calculation of the potential profiles with the resistive feature approximation involved the determination of the steady-state current to the feature surface and solution of the current continuity in a resistive feature. Both solutions required the solution of Laplace's equation with differing boundary conditions. The resistive feature approximation was used to study the role surface and bulk conductivities have on the potential profiles. It was shown for submicron features that the conductivities of most bulk materials could be approximated as perfectly insulating or conducting; however, surface leak-age and passivation films could lead to circumstances where realistic conductivities are needed to obtain the correct solution. The charging of features was shown to scale inversely with the feature size. Therefore, charging is more significant in larger features. The materials properties of most materials lead to the conclusion that for current paths on the order of 0.25 mum, bulk materials can be treated as either perfect insulators of conductors. However, surface leakage or ultraviolet radiation may also make bulk oxide significantly conductive. Therefore, modeling it as a resistive material is required. Finally, the deposition of thin insulating layers on conductive materials could easily lead to feature charging. (C) 2002 American Vacuum Society.
引用
收藏
页码:1084 / 1095
页数:12
相关论文
共 50 条
  • [1] Etching of polysilicon in inductively coupled Cl2 and HBr discharges.: I.: Experimental characterization of polysilicon profiles
    Mahorowala, AP
    Sawin, HH
    Jones, R
    Labun, AH
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (03): : 1055 - 1063
  • [2] Etching of polysilicon in inductively coupled Cl2 and HBr discharges.: III.: Photoresist mask faceting, sidewall deposition, and microtrenching
    Mahorowala, AP
    Sawin, HH
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (03): : 1077 - 1083
  • [3] Etching of polysilicon in inductively coupled Cl2 and HBr discharges.: II.: Simulation of profile evolution using cellular representation of feature composition and Monte Carlo computation of flux and surface kinetics
    Mahorowala, AP
    Sawin, HH
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (03): : 1064 - 1076
  • [4] Plasma-surface kinetics and feature profile evolution in Cl2+HBr etching of polysilicon
    Jin, W
    Vitale, SA
    Sawin, HH
    [J]. PLASMA PROCESSING XIV, 2002, 2002 (17): : 71 - 83
  • [5] Spatially averaged global model of HBr/Cl2 inductively coupled plasma discharges
    Chung, Sang-Young
    Yook, Yeong Geun
    Chang, Won-Seok
    Choi, Heechol
    Im, Yeon Ho
    Kwon, Deuk-Chul
    [J]. PHYSICS OF PLASMAS, 2024, 31 (05)
  • [6] Role of sidewall scattering in feature profile evolution during Cl2 and HBr plasma etching of silicon
    Vyvoda, MA
    Li, M
    Graves, DB
    Lee, H
    Malyshev, MV
    Klemens, FP
    Lee, JTC
    Donnelly, VM
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (02): : 820 - 833
  • [7] Role of sidewall scattering in feature profile evolution during Cl2 and HBr plasma etching of silicon
    Vyvoda, M.A.
    Li, M.
    Graves, D.B.
    Lee, H.
    Malyshev, M.V.
    Klemens, F.P.
    Lee, J.T.C.
    Donnelly, V.M.
    [J]. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 2000, 18 (02): : 820 - 833
  • [8] Role of sidewall scattering in feature profile evolution during Cl2 and HBr plasma etching of silicon
    Vyvoda, M.A.
    Li, M.
    Graves, D.B.
    Lee, H.
    Malyshev, M.V.
    Klemens, F.P.
    Lee, J.T.C.
    Donnelly, V.M.
    [J]. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 2000, 18 (02): : 820 - 833
  • [9] Plasma-surface kinetics and simulation of feature profile evolution in Cl2+HBr etching of polysilicon
    Jin, WD
    Vitale, SA
    Sawin, HH
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2002, 20 (06): : 2106 - 2114
  • [10] Inductively coupled plasma etching of doped GaN films with Cl2/Ar discharges
    Cho, BC
    Im, YH
    Hahn, YB
    Nahm, KS
    Lee, YS
    Pearton, SJ
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (10) : 3914 - 3916