Analysis of the Transient Single-Phase Thermal Performance of Micro-Channel Heat Sinks

The objective of this study is to examine the transient single-phase thermal behavior of micro-channel heat sinks during startup and over a short-duration power surge, and to investigate the effects of property and geometry parameters on this behavior. The transient analysis required the solution of three-dimensional conjugate heat transfer in the heat sink. These solutions were obtained numerically using the finite control-volume method and the numerical accuracy of the results was carefully assessed. Accuracy of the numerical model was validated by comparisons with available experimental data. The behavior of heat sinks with different values for the fin width, channel width, material thickness between the top of the channels and top of the heat sink, and different sink materials was examined during startup from a uniform initial temperature with a uniform input heat flux, followed by a short-duration power surge from the steady-state condition. It is concluded that increasing the fin width or channel width increases the steady-state and maximum transient temperatures in the solid, and that increasing the material thickness between the heat-sink channels and the chip or using a material with larger density and specific heat increases the transient period and lowers the maximum transient temperature in the solid during the power surge.