Numerical mechanics of delamination in multifilms on substrates

Delaminations in film-substrate systems are critical to the fabrication and reliability of microelectronic devices. Due to simple sample preparation and easy testing procedures, the modified edge lift-off test (MELT) and micro-strip test are often used to measure the adhesion This paper presents a detailed finite element analysis of two simplified models relevant to the tests. One is plane strain delamination from the end of a long strip, the other is axisymmetric delamination from the edge of a circular disk. The energy release rate is calculated as a function of delamination length. The correction factor to the simple formula for one film on rigid substrate is obtained to account for the effects of multifilms and substrate flexibility. The numerical results for energy release rate are discussed for MELT and micro-strip test.