Half-conductive coupling interconnection technology for digital transmission between CMOS chips

被引：1

作者：

Devisch, F ^{[1
]}

Maillard, X

Pan, W

De Tandt, C

Vounckx, R

Kuijk, M

机构：

[1] Free Univ Brussels, B-1050 Brussels, Belgium

[2] Siemens, Laser Opt & Laser Proc Dept, Brussels, Belgium

[3] IMEC, Louvain, Belgium

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2002年 / 25卷 / 01期

关键词：

digital transmission; flip-chip technology; half-conductive coupling; interconnection; isolation ratio;

D O I：

10.1109/TADVP.2002.1017690

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper describes how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chip standard CMOS integrated circuits. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Measurements of a complete HC-coupling, digital communication link show reliable operation up to 100 Mb/s channel speed. The two flipped prototype CMOS chips were fabricated in 0.8-mum, 5-V CMOS. The I/O pads' pitch was 150 mum.

引用

页码：92 / 97

页数：6

共 19 条

[1] Half-conductive coupling interconnection technology for digital transmission between CMOS chips
Pan, W
Devisch, F
De Tandt, C
Vounckx, R
Kuijk, M
PROCEEDINGS OF THE IEEE 2000 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2000, : 228 - 230
[2] Half-conductive coupling for chip-to-chip connections
Pan, W.
De Tandt, C.
Devisch, F.
Vounckx, R.
Kuijk, M.
IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 1999, : 29 - 32
[3] Optical interconnection between multilayer chips based on evanescent coupling with taper structure
Zhu, Yupeng
Gao, Xudong
Xu, Zhenzhu
Chong, Yuhua
Dong, Jianji
13TH INTERNATIONAL PHOTONICS AND OPTOELECTRONICS MEETINGS (POEM 2021), 2022, 12154
[4] In-plane optical interconnection with high coupling efficiency between optical chips and waveguides
Oda, Mikio
Guidotti, Daniel
Chang, Gee-Kung
2006 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2006, : 581 - +
[5] Interconnection between technology and Open Innovation in Creative, Digital and Information Technology businesses
Rahimli, Narmina
See-To, Eric W. K.
IFKAD 2017: 12TH INTERNATIONAL FORUM ON KNOWLEDGE ASSET DYNAMICS: KNOWLEDGE MANAGEMENT IN THE 21ST CENTURY: RESILIENCE, CREATIVITY AND CO-CREATION, 2017, : 146 - 163
[6] Proximity Interconnect Technology Utilizing Transmission Line Coupling for Stacked VLSI Chips
Iguchi, Daisuke
Akiyama, Yutaka
Ito, Tsuneo
Otsuka, Kanji
2008 IEEE-EPEP ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2008, : 273 - +
[7] DC substrate coupling between LDMOS and CMOS devices in Hyperintegration I technology
Venkatesan, V
Nguyen, Q
Bose, A
Parris, P
PROCEEDINGS OF THE 1998 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 1998, : 57 - 60
[8] Coupling Device by Self-Written Waveguide Technology for Optical Interconnection between Silicon Photonics Chip and Fiber
Fujikawa C.
Mikami O.
Journal of Japan Institute of Electronics Packaging, 2022, 25 (02) : 166 - 171
[9] Research of the impact of coupling between unit cells on performance of linear-to-circular polarization conversion metamaterial with half transmission and half reflection
Guo, Mengchao
Zhou, Kan
Wang, Xiaokun
Zhuang, Haiyan
Tang, Dongming
Zhang, Baoshan
Yang, Yi
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2018, 32 (10):
[10] Performance comparison of substrate coupling effect between silicon and SOI substrates in RF-CMOS technology
Descamps, P.
Barbier-Petot, C.
Biard, C.
Bardy, S.
ELECTRONICS LETTERS, 2006, 42 (20) : 1151 - 1152

← 1 2 →