Avoiding tin whiskers in Sn-Cu-plated connectors

被引：0
|
作者：
Hunter, Craig [1 ]
Reynolds, Chris [1 ]
机构：
[1] AVX, Myrtle Beach, SC 29578 USA
来源：
CONNECTOR SPECIFIER | 2006年 / 22卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：30 / 30
页数：1
相关论文
共 50 条
  • [1] Tin plated copper alloy materials for connectors
    Masago, Yasushi
    Taira, Koichi
    R and D: Research and Development Kobe Steel Engineering Reports, 2009, 59 (01): : 133 - 136
  • [2] Evaluation of pure tin plated copper alloy substrates for tin whiskers
    Mathew, Sony
    Osterman, Michael
    Pecht, Michael
    Dunlevey, Frank
    CIRCUIT WORLD, 2009, 35 (01) : 3 - 8
  • [3] Influence of Fretting Wear on Lifetime of Tin Plated Connectors
    Ikeda, Hirosaka
    Ito, Tetsuya
    Sawada, Shigeru
    Hattori, Yasuhiro
    Saitoh, Yasushi
    Tamai, Terutaka
    Iida, Kazuo
    IEICE TRANSACTIONS ON ELECTRONICS, 2009, E92C (09) : 1215 - 1222
  • [4] TIN-ALLOY-PLATED CONTACTS FOR ELECTRONIC CONNECTORS
    GARTE, SM
    DIEHL, RP
    PLATING AND SURFACE FINISHING, 1986, 73 (01): : 62 - 65
  • [5] Mechanism of Generation and Suppression of Tin Whiskers on Tin and Tin-Lead Plated Films
    Murakami, Koji
    Okano, Masako
    Hino, Makoto
    Takamizawa, Masao
    Nakai, Kiyomichi
    MATERIALS TRANSACTIONS, 2010, 51 (01) : 143 - 151
  • [6] Role of intrinsic stresses in the phenomena of tin whiskers in electrical connectors
    Lal, S
    Moyer, TD
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2005, 28 (01): : 63 - 74
  • [7] FRETTING DAMAGE IN TIN-PLATED ALUMINUM AND COPPER CONNECTORS
    BRAUNOVIC, M
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (02): : 215 - 223
  • [8] TEM analysis of whiskers formation over tin-plated films
    Otsubo, Fumitaka
    Era, Hidenori
    Tsuru, Yutaka
    Hirano, Shigeru
    MATERIALS CHEMISTRY AND PHYSICS, 2020, 251
  • [9] Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors
    Tamai, Terutaka
    Sawada, Shigeru
    Hattori, Yasuhiro
    IEICE TRANSACTIONS ON ELECTRONICS, 2010, E93C (05) : 670 - 677
  • [10] Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
    Chuang, Tung-Han
    Jain, Chao-Chi
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2011, 42A (03): : 684 - 691
12345