A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism

被引：83
|
作者：
Zhang, Chunbo [1 ]
Li, Leijun [1 ]
机构：
[1] Utah State Univ, Dept Mech & Aerosp Engn, Logan, UT 84322 USA
来源：
METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE | 2009年 / 40卷 / 02期
基金：
美国国家科学基金会;
关键词：
SEAM WELDING SYSTEM; ALUMINUM; CONSOLIDATION; WIRE;
D O I：
10.1007/s11663-008-9224-9
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A three-dimensional (3-D) finite element model has been developed to simulate the coupled thermal-mechanical fields in ultrasonic welding of aluminum foils. Transient distributions and evolution of the in-process variables, including normal stress, shear stress, slide distance, heat generation, temperature, and plastic deformation on the contact interface, and their interactions have been studied in detail. The von Mises plastic strain from the simulation has been correlated with the measured bonded area of ultrasonic joints. A possible mechanism for ultrasonic bond formation is proposed. The severe, localized, plastic deformation at the bond region is believed to be the major phenomenon causing bond formation in ultrasonic welding.
引用
收藏
页码：196 / 207
页数：12
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