Effect of Ion-beam Pre-treatment on the Interfacial Adhesion of Sputter-deposited Cu film on FR-4 Substrate

被引：0

作者：

Min, Kyoung-Jin ^{[1
]}

Park, Sung-Cheol ^{[1
]}

Lee, Ki-Wook ^{[2
]}

Kim, Jae-Dong ^{[2
]}

Kim, Do-Geun ^{[3
]}

Lee, Gun-Hwan ^{[3
]}

Park, Young-Bae ^{[1
]}

机构：

[1] Andong Natl Univ, Sch Mat Sci & Engn, Andong 760749, South Korea

[2] Amkor Technol Korea Inc, Seoul 133706, South Korea

[3] Korea Inst Mat Sci, Dept Surface Technol, Chang Won 641010, South Korea

来源：

JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS | 2009年 / 47卷 / 01期

关键词：

adhesion; peel test; ion-beam pre-treatment; FR-4; substrate; sputter-deposited Cu; CU/POLYIMIDE SYSTEM; SURFACE; PLASMA;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effects of Ar/O-2 ion-beam pre-treatment conditions on the interfacial adhesion energy of sputter-deposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from 45.8 +/- 5.7 g/mm to 61.3 +/- 2.4 g/mm by Ar/O-2 ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to Ar/O-2 ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.

引用

页码：26 / 31

页数：6

共 16 条

[1] Effect of Desmear Treatment on the Interfacial Bonding Mechanism of Electroless-Plated Cu film on FR-4 Substrate
Min, Kyoung-Jin
Park, Young-Bae
KOREAN JOURNAL OF MATERIALS RESEARCH, 2009, 19 (11): : 625 - 630
[2] Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
Oh, Yoong
Kim, Eun Jeong
Kim, Yongdeok
Choi, Kwangseok
Han, Won Bae
Kim, Hee-Soo
Yoon, Chong Seung
THIN SOLID FILMS, 2016, 600 : 90 - 97
[3] Annealing effect on mechanical stress in reactive ion-beam sputter-deposited silicon nitride films
Fourrier, Alain
Bosseboeuf, Alain
Bouchier, Daniel
Gautherin, Guy
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1991, 30 (07): : 1469 - 1474
[4] THE SUBSTRATE HEATING EFFECTS ON ION-BEAM SPUTTER-DEPOSITED CUINS2 AND GAP THIN-FILMS
CHEN, JR
NEE, CC
HWANG, HL
LU, L
LIU, YC
APPLICATIONS OF SURFACE SCIENCE, 1982, 11-2 (JUL): : 544 - 552
[5] EFFECT OF GROWTH-CONDITIONS ON THE STRUCTURAL-PROPERTIES OF ION-BEAM SPUTTER-DEPOSITED SIGE EPILAYERS
LYAKAS, M
ARAZI, T
EIZENBERG, M
DEMUTH, V
STRUNK, HP
MOSLEH, N
MEYER, F
SCHWEBEL, C
JOURNAL OF APPLIED PHYSICS, 1995, 78 (08) : 4975 - 4981
[6] ION-BEAM MIXING MODIFICATION OF SPUTTER-DEPOSITED MOLYBDENUM FILMS ON SI3N4 CERAMICS
BAI, MW
ZHANG, XS
THIN SOLID FILMS, 1994, 249 (02) : 183 - 186
[7] ANNEALING EFFECT ON MECHANICAL-STRESS IN REACTIVE ION-BEAM SPUTTER-DEPOSITED SILICON-NITRIDE FILMS
FOURRIER, A
BOSSEBOEUF, A
BOUCHIER, D
GAUTHERIN, G
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1991, 30 (07): : 1469 - 1474
[8] EFFECTS OF SUBSTRATE-TEMPERATURE AND ANGULAR POSITION ON THE PROPERTIES OF ION-BEAM SPUTTER-DEPOSITED FE FILMS ON (100) GAAS SUBSTRATES
BERNSTEIN, SD
WONG, TY
TUSTISON, RW
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (02): : 605 - 612
[9] Effect of Wet Pre-treatment on Interfacial Adhesion Energy of Direct Cu-Cu Bond
Jang, E. J.
Kim, B.
Matthias, T.
Hyun, S.
Lee, H. J.
Park, Y. B.
PROCEEDINGS OF THE 2009 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2009, : 165 - +
[10] Effect of plasma pre-treatment on nanocrystalline silicon film deposited without substrate heating
Kim, Sun-Jae
Han, Sang-Myeon
Ha, Tae-Jun
Han, Min-Koo
IDW '07: PROCEEDINGS OF THE 14TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3, 2007, : 1997 - 1998

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