IC package and bonding wire modeling software and its application to RFIC design

被引：0
|
作者：
Goto, K [1 ]
Dec, A [1 ]
Horio, Y [1 ]
Suyama, K [1 ]
Akima, H [1 ]
机构：
[1] Tokyo Denki Univ, Tokyo 101, Japan
来源：
2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2002年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents an IC package and bonding wire modeling software which generates an equivalent lumped circuit model from physical information of IC package and bonding wires. The resulting model takes into account the effects of frequency-dependent resistance, capacitance, as well as self and mutual inductance. The accuracy of the modeling approach has been verified using a 20-pin lead-less plastic chip carrier package. Furthermore, the application of the IC package characterization software to the design of a 700 MHz CMOS VCO has also been demonstrated.
引用
收藏
页码：2109 / 2112
页数：4
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