Plane thermal stresses in a functionally graded plate subjected to a partial heating

This paper presents plane thermal stresses in a functionally graded plate (FGP) subjected to a partial heating. The heat conductivity, Young's modulus and the coefficient of the linear thermal expansion are expressed by exponential functions of the position. The analytical solution for the FGP with two-dimensional temperature distribution is obtained by use of the stress function method. General solution of the governing equation of the stress function is derived in the functionally graded materials (FGMs). The numerical calculations are carried out for ZrO2Ti-6-Al-4-V and ZrO2/stainless (SUS304) functionally graded plates, when the ceramic surface is partially heated. The numerical results are shown in figures for two cases. Even though the FGM, suitable selection of the compositional materials does not produce thermal stresses in the FGP.