Low cost anodic bonding for MEMS packaging applications

被引：13
|
作者：
Joyce, Robin [1 ,2 ]
Singh, Kulwant [1 ,2 ]
Sharma, Himani [2 ,3 ]
Varghese, Soney [1 ]
Akhtar, J. [2 ]
机构：
[1] NIT, Sch Nano Sci & Technol, Nanomat & Device Res Lab, Calicut, Kerala, India
[2] CSIR Cent Elect Engn Res Inst, Sensors & Nanotechnol Grp, Pilani, Rajasthan, India
[3] Korean Inst Sci & Technol, Saarbruechen, Germany
来源：
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2014年 / 20卷 / 06期
关键词：
GLASS;
D O I：
10.1007/s00542-013-1834-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Anodic bonding of Pyrex 7740 glass to bare silicon and oxidized silicon wafer is presented for micro electro mechanical systems (MEMS) device packaging. Experimentally it has been observed that anodic bonding process parameters are varying with different 3D structures. The effects of bonding temperature and voltage are discussed by keeping the temperature constant and varying the voltage. The bonding interface has been studied by scanning electron microscope observations. Effective parameters for MEMS structure such as bonding temperature, voltage has been discussed.
引用
收藏
页码：1153 / 1158
页数：6
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