Grain size evaluation with time-frequency ultrasonic backscatter

被引:7
|
作者
Bu, Yangguang [1 ]
Liu, Xiling [1 ]
Turner, Joseph A. [2 ]
Song, Yongfeng [1 ]
Li, Xiongbing [1 ]
机构
[1] Cent South Univ, Sch Traff & Transportat Engn, Changsha 410075, Peoples R China
[2] Univ Nebraska, Mech & Mat Engn, Lincoln, NE 68588 USA
基金
国家重点研发计划;
关键词
Ultrasonic backscatter; Time-frequency analysis; Short-time fourier transform; Sensitivity analysis; Grain size evaluation; FLAW DETECTION; SCATTERING; ATTENUATION; TRANSDUCERS; CALIBRATION;
D O I
10.1016/j.ndteint.2020.102369
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The ultrasonic backscatter signal can be used to evaluate the grain size of polycrystalline media nondestructively. In this article, the joint time-frequency analysis is introduced into the ultrasonic backscatter model, with the independent scattering approximation. The time-frequency domain model is applied to predict the spatial variance surface (SVS) and fit the experimental results to evaluate the grain size with the approach giving a relative error of 2.26% in comparison with metallography. Moreover, it shows that the present method sup-presses electrical noise better than either the time domain or the frequency domain models alone. Based on the global sensitivity analysis of Sobol's method, the sensitivities of transducer parameters and material parameters in the ultrasonic backscatter model are estimated. The sensitivity analysis shows that not all the transducer parameters in the model must be calibrated carefully. In addition, it is found that the grain size sensitivity index of the time-frequency backscatter model is higher than the time domain or the frequency-domain backscatter models. Overall, the backscatter model in the time-frequency domain can evaluate the microstructure more accurately.
引用
收藏
页数:9
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