Analysis for active integrated antenna arrays with 2D-and 3D-printed EBGs

被引:3
|
作者
Kawasaki, S [1 ]
Sasaki, R [1 ]
Ishida, H [1 ]
机构
[1] Tokai Univ, Dept Elect & Elect Engn, Hiratsuka, Kanagawa 2591292, Japan
关键词
active integrated antenna; electromagnetic band gap; unified simulator; via-file data-matching technique;
D O I
10.1002/mmce.20009
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
A nonlinear circuit simulator and an electromagnetic simulator based on FDTD analysis are combined simultaneously to obtain circuit characteristics and field distribution for analysis of a 10-GHz slot antenna with a printed electromagnetic band gap (EBG) structure and a 23-GHz active integrated antenna (AIA) array. Experimentally, the printed EBG exhibits good performance in the active integrated antenna. The injection-reflection matching method in the time domain via a data file, called the via-file data-matching technique, is proposed as a simulation technique to connect with different types of simulation as well as different analytical conditions. The results are compared with those obtained using commercial software packages. The characteristics obtained from the simulation agreed with the experimental data, and the field distribution created by the simulator can help us understand wave-propagation behavior in the array. (C) 2004 Wiley Periodicals, Inc.
引用
收藏
页码:262 / 273
页数:12
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