Performance study of new pixel hybrid photon detector prototypes for the LHCb RICH counters

被引：41
|
作者：
Moritz, M [1 ]
Rinella, GA
Allebone, L
Campbell, M
Gys, I
Newby, C
Pickford, A
Piedigrossi, D
Wyllie, K
机构：
[1] Univ Palermo, DIEPA, Dipartimento Ingn Elettr, I-90128 Palermo, Italy
[2] CERN, CH-1211 Geneva 23, Switzerland
[3] Univ London Imperial Coll Sci & Technol, London SW7 2AZ, England
[4] Univ Oxford, Oxford OX1 3RH, England
[5] Univ Glasgow, Glasgow G12 8QQ, Lanark, Scotland
来源：
IEEE TRANSACTIONS ON NUCLEAR SCIENCE | 2004年 / 51卷 / 03期
关键词：
bump-bonding; Cherenkov detectors; hybrid photon detectors; microelectronics; particle physics;
D O I：
10.1109/TNS.2004.829450
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A pixel hybrid photon detector (HPD) has been developed according to the specific requirements of the LHCb ring imaging Cherenkov counters. This detector comprises a silicon pixel detector bump-bonded to a binary readout chip to achieve a fast 25-ns readout and a high signal-to-noise ratio (SNR). The detector performance was characterized by varying the pixel threshold, the tube high voltage, the silicon bias voltage, and the determination of the photoelectron detection efficiency. Furthermore, accelerated ageing and high pixel occupancy tests were performed to verify the long-term stability. The results were obtained using Cherenkov light and a fast pulsed light emitting diode. The results of all measurements agree with the expectations and fulfill the design goals.
引用
收藏
页码：1060 / 1066
页数：7
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