High-frequency microinductors with amorphous magnetic ground planes

被引:75
|
作者
Crawford, AM [1 ]
Gardner, D
Wang, SX
机构
[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
[2] Intel Corp, Santa Clara, CA 95054 USA
[3] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[4] Stanford Univ, Dept Mat Sci, Stanford, CA 94305 USA
基金
美国国家科学基金会;
关键词
amorphous materials; CoTaZr; ground shield; high frequency; integrated inductor; RY integrated circuits; silicon;
D O I
10.1109/TMAG.2002.802403
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For the first time, inductors were fabricated on silicon using standard silicon processing tools. The 2.75 turn device exhibits a cutoff frequency of 3.3 GHz. The study incorporated ground planes of amorphous CoTaZr below and above the inductor. CoTaZr has a resistivity of similar to 100 muOmega (.) cm, a 4piM(s) of 15 kG, a permeability of similar to 870 up to 1.4 GHz, and an H-c of 0.2 Ge (unpatterned film). These properties were monitored during the process and showed no signs of degradation, even after being exposed to process temperatures of 400 degreesC. Octagonal devices with slotted ground planes had the best frequency response with a cutoff frequency of 3.3 GHz for inductors with 0.4-mum-thick ground planes. Maximum inductive enhancement (over air-core inductors) of 50%-60% has been measured for devices with 1 pm of CoTaZr underneath the inductor. Similarly, two layers of 0.4-mum CoTaZr exhibit increased inductance of 30%-40% with one ground plane and up to 150% with two ground planes.
引用
收藏
页码:3168 / 3170
页数:3
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