Next-Generation Silicon Photonic Interconnect Solutions

被引：0

作者：

Bohn, Marc ^{[1
]}

Magill, Peter ^{[1
]}

Hochberg, Michael ^{[1
]}

Scordo, Dominick ^{[1
]}

Novack, Ari ^{[1
]}

Streshinsky, Matt ^{[1
]}

机构：

[1] Elenion Technol, 171 Madison Ave,Suite 1100, New York, NY 10016 USA

来源：

2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC) | 2019年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silicon Photonics (SiPh) is expected to be the technology platform to address next-generation optical interconnect solutions. By leveraging existing semiconductor production infrastructure and processes as well as building complex optical system-on-chip solutions by shrinking photonics and co-designing with electronics, SiPh enables opportunities for a wide range of fundamentally new applications.

引用

页数：3

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