Analysis of Decoupling Capacitors Inside Via Arrays with Mutual Interaction

被引：0
|
作者：
Erdin, Ihsan [1 ]
Achar, Ramachandra [2 ]
机构：
[1] Celestica Inc, Engn Design Serv, Ottawa, ON, Canada
[2] Carleton Univ, Dept Elect, Ottawa, ON, Canada
来源：
2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) | 2017年
关键词：
Power delivery network; parallel-plate waveguide; decoupling capacitors; power integrity; radial wave propagation; effectiveness radius; MULTILAYER PCBS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new method is developed to assess the effectiveness of local decoupling capacitors on parallel-plate power and ground conductors. The proposed method calculates the loop-inductance of multiple capacitors including their mutual interactions and the effect of power and ground vias. The underlying theory is based on computing the driving point impedance of a device power pin which serves as a reference in the evaluation of capacitor's effectiveness. The accuracy of the proposed method is validated by comparing the results to those from a full-wave electromagnetic simulation.
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页数：3
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