Recent Advances in Thermoplastic Microfluidic Bonding

被引:28
|
作者
Giri, Kiran [1 ]
Tsao, Chia-Wen [1 ]
机构
[1] Natl Cent Univ, Dept Mech Engn, Taoyuan 320, Taiwan
关键词
microfluidic chip fabrication; microfluidic bonding; thermoplastic bonding; polymer microfabrication; CYCLIC OLEFIN COPOLYMER; SURFACE MODIFICATION; ELASTOMER FILM; CHIP DEVICES; PMMA; FABRICATION; ADHESIVE; PLASMA; CHANNELS; PDMS;
D O I
10.3390/mi13030486
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.
引用
收藏
页数:30
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