Opportunities and challenges for telecommunications technology

被引：0
|
作者：
Rantala, J [1 ]
机构：
[1] Nokia Res Ctr, Nokia Grp, FIN-00045 Helsinki, Finland
来源：
THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS | 2004年
关键词：
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
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页码：5 / 5
页数：1
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