Solid-liquid interface energy of silicon

被引:20
|
作者
Jian, Zengyun [1 ]
Kuribayashi, Kazuhiko
Jie, Wanqi
Chang, Fange
机构
[1] Xian Inst Technol, Dept Mat Sci & Engn, Xian 710032, Peoples R China
[2] Inst Space & Astronaut Sci, Sagamihara, Kanagawa 2298510, Japan
[3] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China
基金
中国国家自然科学基金;
关键词
solid-liquid interface energy; undercooling; intermediary growth; silicon;
D O I
10.1016/j.actamat.2006.03.009
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
By examining the morphologies of the recalescence interface and the growing crystal. direct evidence for silicon to grow in intermediary mode has been found, and the critical Undercooling for silicon from lateral growth to intermediary growth Delta T* and that from intermediary growth to continuous growth Delta T** have been determined. A method that predicts the solid-liquid interface energy on the basis of the critical growth transition undercooling has been developed. The solid-liquid interface energy predicted front Delta T* for Silicon is ill very good agreement with that from Delta T**. The percentage error between the solid and liquid interface energies predicted from Delta T* and Delta T** is smaller than 0.59% when the temperature is ill the range 783-1683 K. The results obtained for the solid-liquid interface energy predicted from the critical growth transition undercoolings for silicon are also consistent with the reported results from the nucleation method and the grain boundary method. Their percentage errors are in the range 0.24-4.55%. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:3227 / 3232
页数:6
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