CBGA solder joint thermal fatigue life estimation by a simple method

被引：2
|
作者：
Wong, TE [1 ]
Lau, CY [1 ]
Fenger, HS [1 ]
机构：
[1] Raytheon Co, Elect Syst, El Segundo, CA USA
来源：
SOLDERING & SURFACE MOUNT TECHNOLOGY | 2004年 / 16卷 / 02期
关键词：
soldering; joining processes; fatigue; thermal properties of materials;
D O I：
10.1108/09540910410537327
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic SnPb solder on both top and bottom of the ball. A closed-form solution. based on the calculation of the equilibrium of the displacements within the electronic package assembly, was first derived in order to calculate the solder joint strains during temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution for the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials. A fatigue life prediction model was established.
引用
收藏
页码：41 / 45
页数：5
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