Properties of Soldering Cu/Fe Alloy Produced by Powder Metallurgy

被引：1
|
作者：
Sueyoshi, Hidekazu [1 ]
Ishii, Ryosuke [1 ]
Fukudome, Hisayoshi [1 ]
Mizokuchi, Shinji [2 ]
Wakabayashi, Toshio [2 ]
Saikusa, Kazuya [2 ]
机构：
[1] Kagoshima Univ, Grad Sch Sci & Engn, Kagoshima 8900065, Japan
[2] JAPAN UNIX Co Ltd, Techno Ctr, Kumamoto 8612202, Japan
来源：
JOURNAL OF THE JAPAN INSTITUTE OF METALS | 2009年 / 73卷 / 06期
关键词：
lead-free solder; copper/iron alloy; powder metallurgy; wettability; thermal conductivity;
D O I：
10.2320/jinstmet.73.414
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
In order to develop an advanced soldering material, the Cu/Fe alloys were produced by using powder metallurgy and the soldering properties were examined. Thermal conductivity of Cu/Fe alloy decreased with the increase in the volume fraction of pores, while it increased with the increase in the volume fraction of Cu particles. Wettability of Cu/Fe alloy was better than that of conventional Fe plating, resulting in a reduction in soldering temperature. Comparing the consumption amounts under the same wettability, the amount of Cu/Fe alloy consumed was smaller than that of Fe plating consumed.
引用
收藏
页码：414 / 420
页数：7
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