Development of novel polymer thick film materials for diverse printed electronics applications

被引:0
|
作者
Dorfman, Jay [1 ]
机构
[1] DuPont Co Inc, Microcircuit Mat, Res Triangle Pk, NC USA
关键词
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
158
引用
收藏
页数:1
相关论文
共 50 条
  • [1] Thick Film Polymer Composites with Graphene Nanoplatelets for Use in Printed Electronics
    Janczak, D.
    Sloma, M.
    Wroblewski, G.
    Mlozniak, A.
    Jakubowska, M.
    [J]. MECHATRONICS 2013: RECENT TECHNOLOGICAL AND SCIENTIFIC ADVANCES, 2014, : 73 - 78
  • [2] Printed nanoparticulate composites for silicon thick-film electronics
    Britton, D. T.
    Härting, M.
    [J]. PURE AND APPLIED CHEMISTRY, 2006, 78 (09) : 1723 - 1739
  • [3] Polymer thick film materials for integral resistors
    Xiao, AY
    Tong, QK
    Savoca, AC
    [J]. 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 88 - 92
  • [4] Development of a Low Temperature PZT/Polymer Paste for Screen Printed Flexible Electronics Applications
    Almusallam, Ahmed
    Yang, Kai
    Zhu, Dibin
    Torah, Russel
    Tudor, John
    Beeby, Steve
    [J]. 2014 IEEE SENSORS, 2014, : 2183 - 2186
  • [5] Composite materials for printed electronics in Internet of Things applications
    K Janeczek
    [J]. Bulletin of Materials Science, 2020, 43
  • [6] Composite materials for printed electronics in Internet of Things applications
    Janeczek, K.
    [J]. BULLETIN OF MATERIALS SCIENCE, 2020, 43 (01)
  • [7] Wilhelmy Plate Method of Polymer Film Surfaces for Printed Electronics
    Abe, Koji
    Kusaka, Yasuyuki
    Fujita, Mariko
    Yamamoto, Noritaka
    Ushijima, Hirobumi
    [J]. MOLECULAR CRYSTALS AND LIQUID CRYSTALS, 2015, 622 (01) : 19 - 24
  • [8] THICK-FILM MATERIALS FOR ELECTROOPTIC APPLICATIONS
    STEIN, SJ
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (04): : 358 - &
  • [9] THICK-FILM MATERIALS FOR ELECTROOPTICAL APPLICATIONS
    BRYANT, DL
    STEIN, SJ
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (09): : 728 - &
  • [10] Development of Stretchable Epoxy Film with High Thermal Stability, Especially Suitable for Printed Electronics Applications
    Doi, Iori
    Komori, Takashi
    Yamane, Noriyasu
    Nozawa, Kotaro
    Hirai, Takayoshi
    [J]. 2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021), 2021, : 79 - 80