Power Module Packaging Technologies for Silicon and Silicon Carbide in Automotive applications - challenges and solutions

被引：0
|
作者：
Grasshoff, Thomas [1 ]
Beckedahl, Peter [1 ]
机构：
[1] Semikron Int GmbH, Nurnberg, Germany
来源：
DRITEV - DRIVETRAIN FOR VEHICLES, EDRIVE, TRANSMISSIONS IN MOBILE MACHINES, 2018 | 2018年 / 2328卷
关键词：
D O I：
暂无
中图分类号：
U [交通运输];
学科分类号：
08 ; 0823 ;
摘要：
Power electronics is a key in the area of car electrification. Today, the electric drive train uses silicon based IGBT power modules. Different assembly technologies are used to optimize performance, size and reliability supporting the trend towards car specific power modules. In future, wide band gap semiconductors materials such as SiC may be used as semiconductor solutions to improve performance and reduce the system costs.
引用
收藏
页码：565 / 576
页数：12
相关论文
共 50 条
  • [1] Silicon Carbide Power Electronic Module Packaging
    He Shaowei
    Que, Longcheng
    Lv Jian
    Ang, Simon S.
    [J]. 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [2] Silicon carbide power die packaging in diamond substrate multichip power module applications
    Lostetter, AB
    Olejniczak, KJ
    Malshe, AP
    Brown, WD
    Elshabini, A
    [J]. 2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 389 - 393
  • [3] Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field
    Rundo, Francesco
    Calabretta, Michele
    Rundo, Michael S.
    Castagnolo, Giulia
    Pino, Carmelo
    Battiato, Sebastiano
    Messina, Angelo A.
    [J]. 2024 IEEE INTERNATIONAL WORKSHOP ON METROLOGY FOR AUTOMOTIVE, METROAUTOMOTIVE 2024, 2024, : 18 - 23
  • [4] Review and Prospect of Key Packaging Technologies for Silicon Carbide Power Devices
    Sheng K.
    Dong Z.
    Wu X.
    [J]. Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2019, 39 (19): : 5576 - 5584
  • [5] Packaging Technology of Power Module for Automotive Applications
    Shimozuma, Ayako
    Hayashi, Hiromasa
    Higuchi, Shingo
    Sakamoto, Yoshitsugu
    Okada, Sakie
    [J]. 2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 117 - 121
  • [6] Silicon Carbide High-Temperature Packaging Module Fabrication
    Brokaw, Wendell
    Elmes, John
    Grummel, Brian
    Shen, Z. John
    Wu, Thomas X.
    [J]. 2013 1ST IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2013, : 178 - 181
  • [7] Advanced Packaging of SiC Power Module for Automotive Applications
    Liang, Zhenxian
    Ning, Puqi
    Wang, Fred
    [J]. 2013 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2013, : 2884 - 2891
  • [8] Development of an Extreme Temperature Range Silicon Carbide Power Module for Aerospace Applications
    Katsis, Dimosthenis C.
    Zheng, Yunqi
    [J]. 2008 IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-10, 2008, : 290 - +
  • [9] Modular Design of Coldplate For Cooling Power Module - Application to LV100 packaging module Silicon Carbide
    Vahier, M.
    Moison, Y.
    Pektova, M.
    Cherief, W.
    Giolat, J.
    [J]. 2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC, 2023,
  • [10] Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
    Osman, Ammar
    Moreno, Gilberto
    Myers, Steve
    Major, Joshua
    Feng, Xuhui
    Narumanchi, Sreekant V. J.
    Joshi, Yogendra
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2024, 146 (02)
12345