A Test Bench Concept and Method for Image-Based Modeling of Geometric Wire Bending Behavior in Needle Winding Processes

被引:0
|
作者
Kohler, Markus [1 ,2 ]
Gerngross, Martin [2 ]
Endisch, Christian [2 ]
机构
[1] Tech Univ Munich, Sch Engn & Design, Dept Energy & Proc Engn, Munich, Germany
[2] TH Ingolstadt, Inst Innovat Mobil, Ingolstadt, Germany
关键词
wire forming; manufacturing; computer vision; machine vision; image processing; curve fitting; splines; COPPER;
D O I
10.1109/ISIE51582.2022.9831494
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The needle winding technology offers the potential to produce high-quality windings for electrical machines. However, realizing this potential requires detailed process knowledge, especially of wire behavior. Therefore, this paper describes the first steps toward detailed data-driven modeling of geometric wire behavior in needle winding processes. We develop a purpose-built test bench that can replicate arbitrary wire bending geometries occurring during regular needle winding. By constraining the wire deformations to a two-dimensional plane, the setup allows the resulting wire shapes, which are otherwise difficult to model and capture, to be recorded with a camera. From the resulting images, a dedicated image processing pipeline extracts detailed spline models of wire bending geometry. Thus, datasets can be recorded which assign the essential influencing factors to mathematical models of the wire bending geometry. Analyses of resulting model behavior show accurate approximation results and confirm the suitability of the developed test bench concept and image processing method for capturing and evaluating wire bending geometries. Thus, this work lays the foundation for an efficient data-driven model of wire bending geometry as a function of wire tensile force and wire exit angles at the needle outlet.
引用
收藏
页码:1113 / 1120
页数:8
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    [J]. 2022 IEEE/AIAA TRANSPORTATION ELECTRIFICATION CONFERENCE AND ELECTRIC AIRCRAFT TECHNOLOGIES SYMPOSIUM (ITEC+EATS 2022), 2022, : 894 - 901
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    Chen, S
    Yue, ZQ
    Tham, LG
    Lee, PKK
    [J]. INTERNATIONAL JOURNAL OF ROCK MECHANICS AND MINING SCIENCES, 2004, 41 (03) : 447 - 447
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    E. Sauvage
    S. Celi
    W. Norman
    E. Vignali
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    Sauvage, E.
    Celi, S.
    Norman, W.
    Vignali, E.
    Landini, L.
    Schievano, S.
    Positano, V.
    Capelli, C.
    [J]. CARDIOVASCULAR ENGINEERING AND TECHNOLOGY, 2020, 11 (05) : 532 - 543
  • [5] Experimental investigation of single and butt-welded GFRP filament winding tubes bending behavior based on conventional and Digital Image Correlation method
    Brahem, Nessrine
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    Kujime, T.
    Tane, M.
    Hyun, S. K.
    Nakajima, H.
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