Cooling assessment and distribution of heat dissipation of a cavity down plastic ball grid array package - NuBGA

被引：0
|
作者：
Lau, J
Chen, T
机构：
来源：
1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 1997年 / 3235卷
关键词：
NuBGA; PBGA; heat sink; heat spreader; heat dissipation; and thermal resistance;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The thermal performance of a cost-effective cavity-down plastic ball grid array package is studied by both experimental measurement and finite element methods. The temperature and heat-dissipation distributions and thermal resistance of the package, NuBGA, for different sizes of heat spreader are determined. Also, different heat-sink attachments onto the heat spreader to further enhance the package cooling capability is presented.
引用
收藏
页码：482 / 493
页数：12
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