Design & validation of the Pentium® III and Pentium® 4 processors power delivery

被引:45
|
作者
Rahal-Arabi, T [1 ]
Taylor, G [1 ]
Ma, M [1 ]
Webb, C [1 ]
机构
[1] Intel Corp, Log Technol Dev, Santa Clara, CA 95051 USA
关键词
D O I
10.1109/VLSIC.2002.1015090
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, we present an empirical approach for the validation of the power supply impedance model. The model is widely used to design the power delivery for high performance systems. For this purpose, several silicon wafers of the Pentium(R) III and Pentium(R) 4 processors were built with various amount of decoupling. The measured data showed significant discrepancies with the model predictions and provided useful insights in investigating the model regions of validity.
引用
收藏
页码:220 / 223
页数:4
相关论文
共 50 条
  • [1] Design and validation of the core and IOs decoupling of the Pentium® III and Pentium® 4 processors
    Rahal-Arabi, T
    Taylor, G
    Ma, M
    Jones, J
    Webb, C
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2002, : 249 - 252
  • [2] Pentium III processors power CompactPCI board
    Webb, W
    EDN, 2000, 45 (07) : 19 - 19
  • [3] Single event upset characterization of the Pentium® 4, Pentium® III and Low Power Pentium® MMX microprocessors using proton irradiation
    Hiemstra, DM
    Yu, S
    Pop, M
    2002 IEEE RADIATION EFFECTS DATA WORKSHOP, WORKSHOP RECORD, 2002, : 51 - 57
  • [4] Powering Intel® Pentium® 4 generation processors
    Zhang, MT
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, : 215 - 218
  • [5] How to maximize software performance of symmetric primitives on pentium III and 4 processors
    Matsui, M
    Fukuda, S
    FAST SOFTWARE ENCRYPTION, 2005, 3557 : 398 - 412
  • [6] How we made the Pentium processors
    Robert P. Colwell
    Nature Electronics, 2019, 2 : 83 - 84
  • [7] How we made the Pentium processors
    Colwell, Robert P.
    NATURE ELECTRONICS, 2019, 2 (02) : 83 - 84
  • [8] PENTIUM POWER DOWN
    不详
    ELECTRONICS WORLD & WIRELESS WORLD, 1995, (1717): : 1006 - 1006
  • [9] Cache coherency design in Pentium III SMP system
    Liu, Jinsong
    Zhang, Jiangling
    Gu, Xiwu
    Wuhan University Journal of Natural Sciences, 2006, 11 (02) : 360 - 364
  • [10] Design and performance evaluation of Pentium® III microprocessor packaging
    Sarangi, A
    Ji, G
    Arabi, T
    Taylor, GF
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, : 291 - 294